Opening Hour

Mon - Fri, 9:00 - 18:00

Call Us

+86-371-66302886

aluminum circle

Image

Aluminum Circle for cookware

+

Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

Image

Aluminum disc circle for lighting

+

Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

Aluminum disc circle for signs

+

Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

Image

Aluminum disc circle for bottles

+

Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

Image

Aluminum disc circle for vessels

+

Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

Image

Custom thickness aluminum disc circle

+

Metal alloy: 1xxx, 3xxx, 5xxx, 6xxx, 8xxx etc Temper: O – H112, T3 – T8, T351 – T851 Diameter: 80mm – 1600mm Thickness: 0.3mm – 4mm

metallized dbc aln ceram plate aluminum nitride su

Image

Relationship between the thermal stress and structures of ...

2019-2-19 · The cracking of nickel-plating films, which are typically utilized to prevent the oxidation of underlying metal conductor layers, is an important issue that affects the reliability of metalized ceramic substrates at high temperatures. In this study, we examined the structures of cracks formed in electroless nickel-phosphorous plating films deposited on -metalized silicon–nitride ...

Image

(PDF) Sintered for a metallized ceramic ...

An aluminum nitride (AlN) based package was developed for use at temperatures up to 600°C. AlN substrates were metallized with thick film refractory (Mo) and with thin film refractory ...

Image

Fabrication of 3D metal-ceramic (Al-AlN) architectures ...

2021-2-1 · In the course of this work the fabrication of a metal-ceramic hybrid system is investigated, using high thermal conductive aluminum nitride (180 W/mK ) as substrate material, on which parts of the aluminum alloy AlSi10Mg are printed by using the L-PBF process. To activate the substrate's surface, the AlN ceramic is metallized by physical vapor ...

Image

Morphology of thick film metallization on aluminum nitride ...

2015-12-1 · Surface metallization of aluminum nitride is performed by a reactively thick film method. A layer of film is deposited on the surface of AlN ceramics. The morphology and composition of the metalized layer on ceramic substrate were investigated via scanning electron microscope (SEM) and X-ray diffraction (XRD).

Image

Thermoelectric Devices: A Review of Devices, Architectures ...

Aluminum nitride (AlN) ceramics that are costlier may be preferred due to its higher thermal conductivity compared with Al 2 O 3. To harvest the energy, the TDG must be brought into tight-fitting contact with the heat source and the heat sink.

Image

Fabrication of 3D metal-ceramic (Al-AlN) architectures ...

2021-2-1 · In the course of this work the fabrication of a metal-ceramic hybrid system is investigated, using high thermal conductive aluminum nitride (180 W/mK ) as substrate material, on which parts of the aluminum alloy AlSi10Mg are printed by using the L-PBF process. To activate the substrate's surface, the AlN ceramic is metallized by physical vapor ...

Image

Substrate - ScienceDirect

2018-1-1 · Typical materials used as ceramic substrates are alumina (Al 2 O 3), aluminum nitride (AlN), and silicon nitride (Si 3 N 4). Fig. 3.2 summarizes the relationship between the thermal conductivity and mechanical properties of these ceramics. The data in Fig. 3.2 are taken from values published in company catalogs. Al 2 O 3 is widely used as it is least expensive, but its thermal conductivity is ...

Image

China Direct Bond Dbc Alumina Ceramic Substrate ...

Ceramics, Zirconia Ceramic, Ceramic Plate manufacturer / supplier in China, offering Direct Bond Dbc Alumina Ceramic Substrate, High Hardness Wear Resistant Polished Zirconia Ceramic Stick, China Factory High-Temperature Industrial Customized Zirconium Oxide Zro2 Zirconia 95% 99% 99.5% High Purity Square Aluminum Oxide Al2O3 Alumina Ceramic Plates and so on.

Image

Sintertechnologie – Ein Überblick – Teil 2

2020-12-1 · [102] Mouawad: On the reliability of stacked metallized ceramic substrates under thermal cycling, CIPS, 2018 [103] Miyazakia: Effect of high temperature cycling on both crack formation in ceramics and delamination of layers in silicon nitride active metal brazing substrates, Ceram. Int., vol. 43, 2017, 5080–5088

Image

Metallized Dbc Aln Ceram แผ่นอลูมิเนียมไนไตรด ...

Metallized Dbc Aln Ceram แผ่นอลูมิเนียมไนไตรด์พื้นผิว, Find Complete Details about Metallized Dbc Aln Ceram แผ่นอลูมิเนียมไนไตรด์พื้นผิว,Metallized Dbc Aln Ceram แผ่น,Metallized อลูมิเนียมไนไตรด์พื้นผิว,Metallized Dbc Aln Ceram ...

Image

Fabrication of 3D metal-ceramic (Al-AlN) architectures ...

2021-2-1 · In the course of this work the fabrication of a metal-ceramic hybrid system is investigated, using high thermal conductive aluminum nitride (180 W/mK ) as substrate material, on which parts of the aluminum alloy AlSi10Mg are printed by using the L-PBF process. To activate the substrate's surface, the AlN ceramic is metallized by physical vapor ...

Image

Improved resistance to thermal fatigue of active metal ...

2018-6-1 · The effect of temperature cycling from −40 to 250 °C on active metal brazing (AMB) substrates for power modules was investigated using newly developed silicon nitride ceramics with both high thermal conductivity of 140 W m −1 K −1 and superior fracture toughness of 10.5 MPa m 1/2.Other types of AMB substrates made of AlN or Si 3 N 4 were also tested for comparison.

Image

Диссертация на тему «Корпуса изделий мощной ...

2001-5-27 · Method for production of aluminum nitride ceramic plate. Патент США № 5165983 МПК B32B 1504, от 24.11.1992 72. R.Reicher, W. Smtana, E.U. Gruber, J.C.Schuster Bonding mechanism and stress distribution of a glass frit free thick film metallization for AlN

Image

Metalized Ceramics - SHENZHEN JINGHUI INDUSTRY .

China Metalized Ceramics catalog of Advanced Alumina Ceramics 96% Metallized Ceramic for Vacuum Devices, High Purity Alumina Metallized Ceramic Vacuum for Discharge provided by China manufacturer - SHENZHEN JINGHUI INDUSTRY LIMITED, page7.

Image

Dissimilar Joining of Pure Aluminum to SiCp/Al-MMCs Using ...

2019-8-13 · To broaden the application of advanced metal matrix composites in the electronic packaging industry, a lead-free AlMgGaLi interlayer was developed for active soldering of aluminum to aluminum metal matrix composites. The effect of joining pressure on the microstructure evolution, interfacial wettability and mechanical properties of the dissimilar joints was investigated. The experimental ...

Image

Morphology of thick film metallization on aluminum nitride ...

Request PDF | Morphology of thick film metallization on aluminum nitride ceramics and composition of interface layer | Surface metallization of aluminum nitride is performed by a reactively thick ...

Image

(PDF) Sintered for a metallized ceramic ...

An aluminum nitride (AlN) based package was developed for use at temperatures up to 600°C. AlN substrates were metallized with thick film refractory (Mo) and with thin film refractory ...